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Press Release


  • TrendForce Maintains 4Q17 NAND Flash Market Outlook After Finding Toshiba’s Capacity Remains Largely Intact Despite Rumors
    10-17-2017 / Alan Chen
    Despite lower-than-expected output caused by certain problems in production lines, Toshiba will be able to deliver its NAND Flash shipments as per the dates and volumes in its fourth-quarter contracts, says DRAMeXchange, a division of TrendForce. After confirming with sources, DRAMeXchange refutes a report alleging that Toshiba’s monthly NAND Flash capacity has been reduced by nearly 100,000 wafers and some of its production lines have been suspended. [ more ]
  • TrendForce Says NAND Flash Market to Regain Balance in 2018 with Annual Bit Supply Growing by 42.9%
    09-27-2017 / Alan Chen
    Demand has exceeded supply in the global NAND Flash market for six consecutive quarters since the third quarter of 2016, according to the latest research from DRAMeXchange, division of TrendForce. During this 2017, NAND Flash demand continues to expand because of the increase in average memory content of smartphones and the strong server market. At the same time, the growth in NAND Flash supply has been constrained by the pace of the major suppliers’ respective technology migrations, which in general have been slower than anticipated. [ more ]
  • Toshiba Memory Corporation to Focus on Catching Up to Samsung in 3D-NAND Production Capacity Following Its Sale to U.S.-Japanese Consortium
    09-21-2017 / Alan Chen
    Toshiba announced on September 20 that the company has agreed to sell its memory business, Toshiba Memory Corporation (TMC) to a U.S.-Japanese consortium represented by U.S. private equity firm Bain Capita for JPY 2 trillion (USD 18 billion). According to DRAMeXchange, a division of TrendForce, the deal will start to have a notable impact on the NAND Flash market in the first half of 2018 as the negotiations took longer than expected. From a medium- to long-term perspective, this deal will inject the necessary capital into TMC so that it can work to become a rival to Samsung in terms of NAND Flash technology and production capacity. [ more ]
  • U.S.-Japanese Consortium Announced as the Front Runner in the Bid for Toshiba’s Memory Business; TrendForce Says Such Deal Will Add Pressure on Samsung in NAND Flash Market
    06-21-2017 / Alan Chen
    Toshiba on June 21 announced that it has chosen a consortium led by U.S.-based Bain Capital and investors backed by the Japanese government as the first-place bidder for the spin-off of the company’s memory business. The deal is set to be finalized on June 28 and completed by March of next year. According to DRAMeXchange, a division of TrendForce, this announcement in the short term could cause the NAND Flash market to start shifting from undersupply to equilibrium this fourth quarter. In the long run, the support and demand provided by the bidding party could help the spun-off memory business to become more competitive against Samsung in terms of NAND Flash production capacity and related technology. [ more ]
  • 1Q17 NAND Flash Revenue Dipped Only 0.4% vs. Prior Quarter as Undersupply Continues to Sway the Market, Says TrendForce
    06-01-2017 / Alan Chen
    The NAND Flash market remained in undersupply in the first quarter of 2017 as it had been in the preceding quarter, according to the latest report from DRAMeXchange, a division of TrendForce. Despite seasonality, the average contract price of NAND Flash chips in the channel market actually surged by 20~25% in the first quarter compared with last year’s fourth quarter. Also, prices of mobile storage products such as eMCP, eMMC and UFS are still climbing. NAND Flash suppliers therefore can expect positive revenue outlook for the entire 2017. [ more ]
  • 3D-NAND to Account for Over 50% of Total NAND Flash Bit Output This Third Quarter and Become Market Mainstream, Says TrendForce
    04-25-2017 / TrendForce
    DRAMeXchange, a division of TrendForce, anticipates that 3D-NAND will formally become the mainstream architecture of NAND Flash memory in the third quarter of 2017 with its share in the total NAND Flash bit output exceeding 50%. Following the footsteps of the leading 3D-NAND producers Samsung and Micron, most NAND Flash suppliers will begin mass production of 64-layer 3D-NAND chips in the second half of 2017. Nonetheless, the overall NAND Flash supply is expected to remain tight through the year due to Apple stocking up components for the next iPhone release and steady demand growth from SSD vendors. [ more ]
  • Intel Aims to Keep Its Lead in Server Storage Market With Optane SSD DC P4800X Series, TrendForce Reports
    04-12-2017 / Alan Chen
    Intel has made waves in the server SSD market with the reveal of its Optane SSD DC P4800X Series this March. Based the company’s in-house 3D XPoint memory, the DC P4800X Series is scheduled for shipments in the second half of 2017. “3D XPoint greatly outperforms NAND Flash and will help Intel reinforce its leading position in the high-end segment of the SSD market that has become increasingly competitive,” said Alan Chen, senior research manager of DRAMeXchange, a division of TrendForce. “In the future, the product roadmap of 3D XPoint could include client-grade SSDs and storage-class memory (SCM) devices. Intel naturally wants to expand the adoption of this technology in other areas as to create flexibility in pricing and consumption of in-house production capacity.” [ more ]
  • Foreign Competitors Set Up Fabs in China and Compel Country’s Domestic Foundries to Expedite Their 28nm Production This Year, Says TrendForce
    04-10-2017 / TrendForce
    United Semiconductor Xiamen (USCXM), China-based subsidiary of major foundry UMC, is reported to begin production on the 28nm technology licensed from its parent company this second quarter. As international semiconductor companies set up fabrication plants in China, the country’s domestic foundries will face intensifying competition in terms of technology, market share and recruitment of technical personnel. According to the global market intelligence firm TrendForce, Semiconductor Manufacturing International Corporation (SMIC) and Shanghai Huali Microelectronics Corporation (HMLC) are the two leaders among Chinese foundries in the development of the 28nm processing. The existence of foreign-owned fabs in China will pressure these two domestic manufacturers to further accelerate their timetables for this technology. [ more ]