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Analysts' Profile



Name: JunShi Zhong

Title: Analyst

Areas of Coverage:

IC Assembly & Testing, IC Packaging Equipment and Materials

Years of Experience :

  • Product Engineer, STMicroelectronics

Education:

  • Department of Mechanical and Electrical Engineering, Xiamen University

Zhong mainly studies the IC Assembly & Testing industry analysis, the development trend analysis of advanced IC packaging technology, and the development trends and tracking analysis of IC packaging equipment & materials etc. in China. He also previously provided services in STMicroelectronics.

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